PCB assembly & test

 
SMT assembly

• PCB size range is from 50mm x 50mm up to 460mm x 460mm
• Thickness from 0.5mm up to 4.3mm
• SMD components are kept in a storage system KARDEX Shuttle
• PCB handling involves an automatic PCB load-unload system on an SMT line
• Selective soldering
• Wave soldering
• Possibility of a fully automatic vision alignment for solder-paste printing
• Double-Side SMT solder-paste printing and reflow
• Glue dispensing or printing and curing for dual-wave soldering.
  

Possibility for the placement of SMT components:

• component sizes from 0201 up to 85mm x 85mm (Odd-Shape 125mm x10mm)
• BGA, µBGA, TSOP, QFP, SMD relays, SMD hybrids, SMD connectors, SMD switches
• CSP, Flip Chip, etc.
• components pitch ≥ 0.4mm placement accuracy ± 50µ
• AOI (Automatic Optical Inspection) after reflow soldering / Glue hardening
• repairing all types of SMD components ( BGA replacement with ZEVAC DRS 22 and ONYX29) 

THT assembly

• PCB size range is from 40mm x 70mm up to 460mm x 380mm
• Thickness from 0.8mm up to 4.3mm
• Possibility to assemble mechanical parts (mechanical subassembly)   
• THT components preparing machines
• Optical component mounting positioning tables:
• Type 1:  Logpoint 2
• Type 2:  Streckfuss B 030,80,90 MP-B
• Manual assembly working places
• Capacity: 4,800 comp/h or depending on current needs